TAIPEI—Taiwanese chip firm TSMC has raised $3.5 billon in bonds for its new plant in the U.S. state of Arizona, according to a term sheet. Taiwan Semiconductor Manufacturing Co. Ltd., a major Apple Inc supplier and the world’s largest contract chip-maker, started construction last year at the Arizona site where it plans to spend $12 billion to build a computer chip factory. By Ben Blanchard and Scott Murdoch ...
Source: https://www.theepochtimes.com/taiwans-t ... 16154.html
Taiwan’s TSMC Raises $3.5 Billion in Bonds for New US Plant
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Taiwan’s TSMC Raises $3.5 Billion in Bonds for New US Plant
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